CONTACT
3D Inspection
특징
1. As a dedicated wafer-level bump inspection system, it enables high-precision and high-speed detection of various types of defects.
2. TOKO TAKAOKA’s proprietary 3D multi-confocal technology enables highly accurate and high-speed inspection.
3. High-speed inspection is further achieved through proprietary software developed and optimized specifically for the 3D confocal measurement system.
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SPEC |
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Main Inspection Item |
Bump
Height&Position&Diameter, Coplanarity, Chip warpage, Missing bump,
Scratch, Foreign material &Bridge …etc |
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Sensor |
SCS-S10330R１ |
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FOV(Field of View) & Wafer Size |
13 mm * 13 mm / Φ300ｍｍ (Wafer Thickness 775±20μm) |
Bump Height Accuracy & Repeatability | 0.3㎛ / 3σAVE ≦0.15㎛ * Various Conditions Available |
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Chip Size & Bump Shape |
２×2～ / Round Coined Recess |
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XY Resolution |
1.67μｍ |
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Bump Diameter(SRO) & Bump Pitch |
≥ Φ12 μm (Note 1) / ≥ 25 μm (Note 1) * Bump top diameter: ≥ Φ12 μm (Note 1) |
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Number of Bumps on a Wafer |
≤ 500 Million / Wafer |
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Throughput |
10 WPH (Depending on operating conditions) |