CONTACT
3D Inspection
특징
1. Simultaneous measurement of substrate warpage, as well as the height and coplanarity of bumps, balls, and LGAs.
2. Capable of measuring both round and flat-type bumps.
3. High-speed, high-precision substrate warpage measurement using programmable temperature control profiles.
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SPEC |
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Main Inspection Item |
HVI-S10000C-RC : Reflow Simulation HVI-S10000C-EC : Environmental Test |
Heating/Cooling System | Convection |
Temperature Range | RC:R.T.～300℃ EC:-55℃～260℃ |
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FOV & Measurement Range |
41mm×33mm&160mm×136mm |
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Measurement Speed | About 2sec./FOV (1mm Z range) |
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Z Range(Max.) |
4,000μm |
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XY Resolution |
11.0μm |
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Dimension |
(W)1,200mm×(D)1,400mm×(H)1,900mm |