CONTACT
3D Inspection
특징
1. Off-line bump inspection for IC package substrates in sheet (panel) form.
2. High-precision, high-speed inspection using TOKO TAKAOKA’s proprietary 3D Multi-Confocal technology.
3. High-resolution color camera review function for defect verification and analysis after inspection.
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SPEC |
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Main Inspection Item |
Bump Height, Coplanarity, C4 Area Warpage |
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S10210 |
S10220 | |
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FOV(Field of View) |
15 mm * 15 mm |
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Z Range |
300μm |
300μm |
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XY Resolution |
3.0μm |
2.1μm |
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Bump Diameter(Min.) & Bump Pitch |
25μm / 55μm |
18μm / 36μm |
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Bump Pitch |
3σAVE.+3σ3σ≦2μm |
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Dimension |
(W)1,560mm×(D)2,220mm×(H)1,800mm |
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