CONTACT
3D Inspection
특징
1. In-line inspection of individual packaging substrates loaded in JEDEC trays, optimized for small and ultra-thin substrates.
2. High-precision, high-speed inspection using TOKO TAKAOKA’s proprietary 3D Multi-Confocal technology.
3. Measurement capability for both round and flat-type bumps.
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SPEC |
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Main Inspection Item |
Bump Height, Coplanarity, C4 Area Warpage |
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S10210 | S10220 | |
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FOV(유효시야) |
13 mm * 13 mm(11 mm * 15 mm, 15mm * 11mm) |
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Z Range |
240μm |
240μm |
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XY Resolution |
3.0μm |
2.1μm |
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Bump Diameter(Min.) & Bump Pitch |
25μm / 55μm |
18μm / 36μm |
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Bump Pitch |
3σAVE.+3σ3σ≦2μm |
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Dimension |
(W)3,020mm×(D)2,245mm×(H)1,800mm |
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