CONTACT
3D Inspection
특징
1. High-precision and high-speed in-line bump inspection using dedicated jigs for next-generation JEDEC substrates.
2. High-precision, high-speed inspection based on TOKO TAKAOKA’s proprietary 3D Multi-Confocal technology.
3. Advanced features including a Double-Shuttle System and wide Z-axis measurement range.
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SPEC |
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Main Inspection Item |
Bump Height, Coplanarity, Diameter |
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S10210 | S10220 | |
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FOV(유효시야) |
15 mm * 15 mm |
15 mm * 15 mm |
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Z Range |
300μm |
300μm |
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XY Resolution |
3.0μm | 2.1μm |
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Bump Diameter(Min.) & Bump Pitch |
25μm / 55μm |
18μm / 36μm |
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Bump Pitch |
3σAVE.+3σ3σ≦2μm |
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Dimension |
(W)2,560mm×(D)2,715mm×(H)1,945mm |
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